PHTB-260 is a high-temperature (260°C) soluble temporary bonding material designed for semiconductor and precision manufacturing applications. It provides excellent bonding strength during high-temperature processing and can be cleanly removed by thermal decomposition or with a designated solvent, leaving no residue or substrate contamination. Ideal for wafer protection, temporary bonding of thin materials, and precision component support, it eliminates the need for UV or laser debonding and reduces the risk of carbon residue.