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High-Temperature / Ultra High-Temperature Temporary Adhesive
HTB-300 Heat-Resistant Soluble Temporary Bonding Treatment Agent
HTB-300 is a high-temperature-resistant (up to 300°C), soluble temporary bonding material designed for semiconductor processing and precision machining applications.
The material maintains excellent bonding strength under high-temperature processing conditions. After processing, it can be completely removed using a designated solvent, leaving no residue and ensuring no contamination of the substrate surface.
HTB-300 is particularly suitable for high-temperature vapor deposition processes used in communication chip manufacturing.
HTB-200 Heat-Resistant Soluble Temporary Bonding Material
HTB-200 is a high-temperature-resistant (up to 200°C), soluble temporary bonding material designed for semiconductor processing and precision machining applications.
The material maintains excellent bonding strength under high-temperature processing conditions. After processing, it can be completely removed using a designated solvent, leaving no residue and ensuring no contamination of the substrate surface.
HTB-200 is particularly suitable for high-temperature processing of sensor chips.
HTB-170 Heat-Resistant Soluble Temporary Bonding Treatment Agent
HTB-170 is a high-temperature-resistant (up to 170°C), soluble temporary bonding material designed for semiconductor processing and precision machining applications.
The material maintains excellent bonding strength under high-temperature processing conditions. After processing, it can be completely removed using a designated solvent, leaving no residue and ensuring no contamination of the substrate surface.
HTB-300 is particularly suitable for high-temperature vapor deposition processes used in communication chip manufacturing.